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312A4783P2 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

312A4783P2: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.280 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-302-9835, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
312A4783P2
NSN: 5962-01-302-9835
NIINs: 013029835, 013029836
FSC: 5962 — Microcircuits, Electronic
CAGE: 89954 — BAE SYSTEMS CONTROLS INC. (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
overall_width0.320 INCHES MAXIMUM IN
overall_height0.400 INCHES MAXIMUM IN
overall_length1.280 INCHES MAXIMUM IN
features_providedBURN IN AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
NSN5962-01-302-9835
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 312A4783P2 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 23 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL HEIGHT0.400 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN23 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
OVERALL LENGTH1.280 INCHES MAXIMUM IN
OVERALL WIDTH0.320 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
SUBSTITUTES & CROSS-REFERENCES 2
PLDC20G10-30DMBReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 145Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 312A4783P2?
312A4783P2 is a MICROCIRCUIT,MEMORY.
What parts can replace 312A4783P2?
There are 2 known substitutes for 312A4783P2: PLDC20G10-30DMB, ROM/PROM FAMILY 145. Substitute compatibility should be verified for your specific system.
What is the NSN for 312A4783P2?
312A4783P2 is cataloged in the U.S. Government catalog under NSN 5962-01-302-9835. This indicates validated use in U.S. government and defense supply chains.
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