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Technical Data Sheet
310033P5 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HIGH SPEED, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-033-1517, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
310033P5
NSN: 5962-01-033-1517
FSC: 5962
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height0.080 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
body_length0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN
features_providedMONOLITHIC AND HIGH SPEED
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern2 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity10 FLAT LEADS
NSN5962-01-033-1517
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,LINEAR TITLE COMPONENT PN 310033P5 MFR MICROCIRCUIT,LINEAR
KEY FEATURES
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, LINEAR
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 10 FLAT LEADS
INCLOSURE MATERIAL: CERAMIC
BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -7.0 VOLTS MINIMUM POWER SOURCE AND 14.0 VOLTS MAXIMUM POWER SOURCE
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
DESIGN FUNCTION AND QUANTITY1 AMPLIFIER, LINEAR
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY10 FLAT LEADS
INCLOSURE MATERIALCERAMIC
BODY HEIGHT0.080 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-7.0 VOLTS MINIMUM POWER SOURCE AND 14.0 VOLTS MAXIMUM POWER SOURCE
BODY WIDTH0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN2 INPUT
MAXIMUM POWER DISSIPATION RATING200.0 MILLIWATTS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
99056353Interchangeable
interchangeable cross-reference
interchangeable
U3F7710312Interchangeable
interchangeable cross-reference
interchangeable
469SCPE153-4Interchangeable
interchangeable cross-reference
interchangeable
161-250-4003Interchangeable
interchangeable cross-reference
interchangeable
M38510/10301BHAInterchangeable
interchangeable cross-reference
interchangeable
M38510/10301BHCInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 310033P5?
310033P5 is a MICROCIRCUIT,LINEAR.
What parts can replace 310033P5?
There are 16 known substitutes for 310033P5: 99056353, U3F7710312, 469SCPE153-4 and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 310033P5?
310033P5 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-033-1517. This indicates validated use in U.S. government and defense supply chains.
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