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Technical Data Sheet
PartsTable / COMPONENT / 31 218-082
31 218-082 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-267-5824, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
31 218-082
NSN: 5962-01-267-5824
FSC: 5962
CAGE: D9853 — ROCKWELL COLLINS DEUTSCHLAND GMBH DIV ROCKWELL COLLINS INTERNATIONAL & SERVICE SOLUTIONS (DEU)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.160 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedW/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-267-5824
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 31 218-082 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
FEATURES PROVIDED: W/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
•
BODY HEIGHT: 0.160 INCHES MAXIMUM IN
•
MAXIMUM POWER DISSIPATION RATING: 907.0 MILLIWATTS
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
BODY LENGTH: 1.060 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC AND GLASS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDEDW/ENABLE AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
BODY HEIGHT0.160 INCHES MAXIMUM IN
MAXIMUM POWER DISSIPATION RATING907.0 MILLIWATTS
INPUT CIRCUIT PATTERN10 INPUT
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
BODY LENGTH1.060 INCHES MAXIMUM IN
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL SURFACE TREATMENTSOLDER
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
53S481AJ883BInterchangeable
interchangeable cross-reference
interchangeable
TT8511835-101Interchangeable
interchangeable cross-reference
interchangeable
AM27S29A/BRAInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 277Interchangeable
interchangeable cross-reference
interchangeable
1206076-1Interchangeable
interchangeable cross-reference
interchangeable
1206076-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 31 218-082?
31 218-082 is a MICROCIRCUIT,MEMORY.
What parts can replace 31 218-082?
There are 23 known substitutes for 31 218-082: 53S481AJ883B, TT8511835-101, AM27S29A/BRA and 20 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 31 218-082?
31 218-082 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-267-5824. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026