30S5: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: STEEL HEAT SINK, body_width: 1.125 INCHES NOMINAL IN, body_length: 1.250 INCHES NOMINAL IN, terminal_type: TAB, SOLDER LUG, inclosure_type: ENCASED, overall_length: 0.350 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-024-0576, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | STEEL HEAT SINK |
| body_width | 1.125 INCHES NOMINAL IN |
| body_length | 1.250 INCHES NOMINAL IN |
| terminal_type | TAB, SOLDER LUG |
| inclosure_type | ENCASED |
| overall_length | 0.350 INCHES MAXIMUM IN |
| heat_sink_width | 10.000 INCHES IN |
| mounting_method | TERMINAL |
| terminal_length | 0.438 INCHES NOMINAL IN |
| heat_sink_length | 10.000 INCHES IN |
| overall_diameter | 0.150 INCHES MAXIMUM IN |
| style_designator | TERMINALS ONE EDGE |
| NSN | 5961-00-024-0576 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS JUNCTION DEGC |
| OVERALL DIAMETER | 0.150 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 0.750 INCHES MINIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.350 INCHES MAXIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 3.00 AMPERES MAXIMUM REVERSE CURRENT, DC |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |