The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, body_width: 1.125 INCHES NOMINAL IN, body_length: 1.250 INCHES NOMINAL IN, terminal_type: TAB, SOLDER LUG, inclosure_type: ENCASED, overall_height: 2.350 INCHES NOMINAL IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5905-00-201-9236, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| body_width | 1.125 INCHES NOMINAL IN |
| body_length | 1.250 INCHES NOMINAL IN |
| terminal_type | TAB, SOLDER LUG |
| inclosure_type | ENCASED |
| overall_height | 2.350 INCHES NOMINAL IN |
| heat_sink_width | 10.000 INCHES IN |
| terminal_length | 0.438 INCHES NOMINAL IN |
| heat_sink_length | 10.000 INCHES IN |
| overall_diameter | 0.145 INCHES NOMINAL IN |
| style_designator | TERMINALS ONE EDGE |
| mounting_hole_size | 0.196 INCHES NOMINAL IN |
| NSN | 5905-00-201-9236 |
| ELECTRICAL RESISTANCE | 5.000 OHMS |
| HEAT SINK LENGTH | 10.000 INCHES IN |
| HEAT SINK THICKNESS | 0.040 INCHES IN |
| BODY WIDTH | 1.125 INCHES NOMINAL IN |
| REACTANCE CHARACTERISTIC | INDUCTIVE |
| DISTANCE BETWEEN CENTERLINES OF MOUNTING FACILITIES PARALLEL TO BODY LENGTH | 2.000 INCHES NOMINAL IN |
| AMBIENT TEMP AT FULL RATED POWER | 40.0 CELSIUS DEGC |
| POWER DISSIPATION RATING IN WATTS | 30.000 HEAT SINK |
| MOUNTING HOLE SIZE | 0.196 INCHES NOMINAL IN |
| HEAT SINK WIDTH | 10.000 INCHES IN |