301037: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_height: 1.813 INCHES NOMINAL IN, overall_width: 1.500 INCHES NOMINAL IN, inclosure_type: HERMETICALLY SEALED, overall_height: 2.187 INCHES NOMINAL IN, overall_length: 1.500 INCHES NOMINAL IN, mounting_method: THREADED STUD(S) SINGLE GROUP. This part is cataloged in the U.S.
Government catalog under NSN 5950-00-869-6372, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_height | 1.813 INCHES NOMINAL IN |
| overall_width | 1.500 INCHES NOMINAL IN |
| inclosure_type | HERMETICALLY SEALED |
| overall_height | 2.187 INCHES NOMINAL IN |
| overall_length | 1.500 INCHES NOMINAL IN |
| mounting_method | THREADED STUD(S) SINGLE GROUP |
| frequency_rating | 200.0 HERTZ NOMINAL SINGLE COMPONENT |
| features_provided | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| NSN | 5950-00-869-6372 |
| OVERALL HEIGHT | 2.187 INCHES NOMINAL IN |
| MOUNTING FACILITY QUANTITY | 4 SINGLE GROUP |
| INCLOSURE TYPE | HERMETICALLY SEALED |
| CENTER TO CENTER DISTANCE BETWEEN MOUNTING FACILITIES PARALLEL TO LENGTH | 1.094 INCHES NOMINAL SINGLE MOUNTING FACILITY SINGLE CENTER GROUP IN |
| MOUNTING METHOD | THREADED STUD(S) SINGLE GROUP |
| BODY HEIGHT | 1.813 INCHES NOMINAL IN |
| OVERALL LENGTH | 1.500 INCHES NOMINAL IN |
| OVERALL WIDTH | 1.500 INCHES NOMINAL IN |
| WINDING FUNCTION AND QUANTITY | 1 PRIMARY AND 2 CONTROL SINGLE COMPONENT |
| SATURATION CURRENT RATING | 8.5 MILLIAMPERES |
No substitute or cross-reference records for this part.