3-26612: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: ALUMINUM ALLOY, thickness: 0.375 INCHES NOMINAL IN, bore_diameter: 0.3590 INCHES NOMINAL IN, surface_finish: 125 MICROINCHES BOTH BEARING FLATS, outside_diameter: 0.500 INCHES NOMINAL IN, style_designator: PLAIN ROUND. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-147-4365, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY |
| thickness | 0.375 INCHES NOMINAL IN |
| bore_diameter | 0.3590 INCHES NOMINAL IN |
| surface_finish | 125 MICROINCHES BOTH BEARING FLATS |
| outside_diameter | 0.500 INCHES NOMINAL IN |
| style_designator | PLAIN ROUND |
| features_provided | HERMETICALLY SEALED CASE |
| surface_treatment | ANODIZE |
| NSN | 5961-00-147-4365 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
No substitute or cross-reference records for this part.