The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include overall_width: 1.050 INCHES MAXIMUM IN, overall_height: 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN, overall_length: 1.573 INCHES MAXIMUM IN, transfer_ratio: 150.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER, mounting_method: UNTHREADED HOLE(S), overall_diameter: 0.875 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5961-00-314-1056, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_width | 1.050 INCHES MAXIMUM IN |
| overall_height | 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN |
| overall_length | 1.573 INCHES MAXIMUM IN |
| transfer_ratio | 150.0 MAXIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 0.875 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| mounting_facility_quantity | 2 |
| NSN | 5961-00-314-1056 |
| OVERALL WIDTH | 1.050 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 2 PIN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| OVERALL HEIGHT | 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 1.553 INCHES MINIMUM AND 1.573 INCHES MAXIMUM IN |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |