The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include overall_length: 0.140 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.500 INCHES MINIMUM IN, overall_diameter: 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: NPN, semiconductor_material: SILICON. This part is cataloged in the Federal Logistics Information System under NSN 5961-01-087-7094, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.140 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES MINIMUM IN |
| overall_diameter | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| semiconductor_material | SILICON |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| terminal_type_and_quantity | 7 UNINSULATED WIRE LEAD |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-01-087-7094 |
| SEMICONDUCTOR MATERIAL | SILICON |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |
| TERMINAL LENGTH | 0.500 INCHES MINIMUM IN |
| TERMINAL TYPE AND QUANTITY | 7 UNINSULATED WIRE LEAD |
| OVERALL DIAMETER | 0.305 INCHES MINIMUM AND 0.335 INCHES MAXIMUM IN |
| TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL IN |
| MOUNTING METHOD | TERMINAL |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| OVERALL LENGTH | 0.140 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |