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29673 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · ORING SEAL
PRODUCT OVERVIEW

29673: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.555 INCHES NOMINAL IN, body_height: 0.180 INCHES NOMINAL IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: STYLE DESIGNATOR:NO.60 IRREGULAR SHAPE FROM FIIG A03200, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY. This part is cataloged in the U.S.

Government catalog under NSN 5330-00-355-8270, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
29673
NSN: 5330-00-355-8270
NIINs: 003558270, 004509220, 012513661, 014916285
FSC: 5330 — Packing and Gasket Materials
CAGE: 35211 — LAUSON DIVISION OF TECUMSEH PRODUCTS CO (USA)
SPECIFICATIONS
body_width0.555 INCHES NOMINAL IN
body_height0.180 INCHES NOMINAL IN
body_length1.290 INCHES MAXIMUM IN
memory_capacityUNKNOWN
special_featuresSTYLE DESIGNATOR:NO.60 IRREGULAR SHAPE FROM FIIG A03200
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5330-00-355-8270
COMPONENT DIAGRAM
O-RING / SEAL — MATERIAL DETERMINES APPLICATION ID: — CROSS-SECTION CS: — SPECIFICATION Material: — Durometer: — Temp: — PN: 29673 MFR: OEM ⚠ VERIFY BEFORE ORDERING Wrong material = failure. Viton for oil/fuel, EPDM for water/steam, Buna-N for general purpose, Silicone for food-grade. Chemical incompatibility causes swelling, brittleness, or rapid degradation ✓ BROKER TIP Durometer (hardness) affects sealing pressure tolerance. Higher Shore A = harder = higher pressure. Standard durometer is 70A — verify if application requires different hardness PARTSTABLE TECHNICAL DRAWING — NOT TO SCALE
KEY FEATURES
•
SUPPLEMENTARY FEATURES: CROSS-SECTIONAL SHAPE STYLE:NO.195 IRREGULAR SHAPE FROM FIIG A03200
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
SUPPLEMENTARY FEATURESCROSS-SECTIONAL SHAPE STYLE:NO.195 IRREGULAR SHAPE FROM FIIG A03200
SPECIAL FEATURESSTYLE DESIGNATOR:NO.60 IRREGULAR SHAPE FROM FIIG A03200
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 29673?
29673 is a MICROCIRCUIT,MEMORY.
What is the NSN for 29673?
29673 is cataloged in the U.S. Government catalog under NSN 5330-00-355-8270. This indicates validated use in U.S. government and defense supply chains.
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