2914FM/B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

2914FM/B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.600 INCHES MINIMUM AND 0.660 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN, body_length: 1.030 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-264-9053, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

2914FM/B

NSN: 5962-01-264-9053
FSC: 5962 — Microcircuits, Electronic
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)

SPECIFICATIONS

body_width	0.600 INCHES MINIMUM AND 0.660 INCHES MAXIMUM IN
body_height	0.070 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN
body_length	1.030 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	26 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-264-9053

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 26 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 CONTROL, INTERRUPT

•

BODY WIDTH: 0.600 INCHES MINIMUM AND 0.660 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	26 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 CONTROL, INTERRUPT
BODY WIDTH	0.600 INCHES MINIMUM AND 0.660 INCHES MAXIMUM IN
BODY HEIGHT	0.070 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR
INCLOSURE CONFIGURATION	FLAT PACK
BODY LENGTH	1.030 INCHES MINIMUM AND 1.090 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

AM2914/BYCReference document

Same NSN cross-reference

Reference document — Secondary reference

AM2914FMBReference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 2914FM/B?

2914FM/B is a MICROCIRCUIT,DIGITAL.

What parts can replace 2914FM/B?

There are 2 known substitutes for 2914FM/B: AM2914/BYC, AM2914FMB. Substitute compatibility should be verified for your specific system.

What is the NSN for 2914FM/B?

2914FM/B is cataloged in the U.S. Government catalog under NSN 5962-01-264-9053. This indicates validated use in U.S. government and defense supply chains.

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2914FM/B — MICROCIRCUIT,DIGITAL

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