28F008SA-40TSOP — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

28F008SA-40TSOP: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 10.000 MILLIMETERS NOMINAL MM, body_height: 1.200 MILLIMETERS NOMINAL MM, body_length: 18.000 MILLIMETERS NOMINAL MM, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-474-3321, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

28F008SA-40TSOP

NSN: 5962-01-474-3321
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	10.000 MILLIMETERS NOMINAL MM
body_height	1.200 MILLIMETERS NOMINAL MM
body_length	18.000 MILLIMETERS NOMINAL MM
features_provided	ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-25.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADED CHIP CARRIER
terminal_type_and_quantity	40 GULLWING
part_name_assigned_by_controlling_agency	MICROCIRCUIT, DIGITAL
NSN	5962-01-474-3321

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: PLASTIC

•

BODY WIDTH: 10.000 MILLIMETERS NOMINAL MM

•

BODY HEIGHT: 1.200 MILLIMETERS NOMINAL MM

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 18.000 MILLIMETERS NOMINAL MM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	PLASTIC
BODY WIDTH	10.000 MILLIMETERS NOMINAL MM
BODY HEIGHT	1.200 MILLIMETERS NOMINAL MM
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM
BODY LENGTH	18.000 MILLIMETERS NOMINAL MM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE	-25.0 TO 125.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

263428089Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 28F008SA-40TSOP?

28F008SA-40TSOP is a MICROCIRCUIT,MEMORY.

What parts can replace 28F008SA-40TSOP?

There is 1 known substitute for 28F008SA-40TSOP: 263428089. Substitute compatibility should be verified for your specific system.

What is the NSN for 28F008SA-40TSOP?

28F008SA-40TSOP is cataloged in the U.S. Government catalog under NSN 5962-01-474-3321. This indicates validated use in U.S. government and defense supply chains.

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