2815555-6 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

2815555-6: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN, body_height: 0.070 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN, body_length: 1.440 INCHES MINIMUM AND 1.490 INCHES MAXIMUM IN, features_provided: STATIC OPERATION AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH RELIABILITY, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-285-6705, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

2815555-6

NSN: 5962-01-285-6705
FSC: 5962 — Microcircuits, Electronic
CAGE: 55972 — HONEYWELL INTL INC DEFENSE AVIONICS SYSTEMS (USA)

SPECIFICATIONS

body_width	0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN
body_height	0.070 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN
body_length	1.440 INCHES MINIMUM AND 1.490 INCHES MAXIMUM IN
features_provided	STATIC OPERATION AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH RELIABILITY
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	25 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-285-6705

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 25 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.070 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN

•

FEATURES PROVIDED: STATIC OPERATION AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH RELIABILITY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	25 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN
BODY HEIGHT	0.070 INCHES MINIMUM AND 0.135 INCHES MAXIMUM IN
FEATURES PROVIDED	STATIC OPERATION AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH RELIABILITY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	1.440 INCHES MINIMUM AND 1.490 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

106729-002Reference document

Same NSN cross-reference

Reference document — Secondary reference

IDT7164L85DBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 2815555-6?

2815555-6 is a MICROCIRCUIT,MEMORY.

What parts can replace 2815555-6?

There are 2 known substitutes for 2815555-6: 106729-002, IDT7164L85DB. Substitute compatibility should be verified for your specific system.

What is the NSN for 2815555-6?

2815555-6 is cataloged in the U.S. Government catalog under NSN 5962-01-285-6705. This indicates validated use in U.S. government and defense supply chains.

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