The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 0.870 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-249-0255, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES NOMINAL IN |
| body_length | 0.870 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 1 BUFFER, HEX |
| NSN | 5962-01-249-0255 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY LENGTH | 0.870 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY HEIGHT | 0.185 INCHES NOMINAL IN |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, HEX |
| INCLOSURE MATERIAL | CERAMIC |