27S29ADM/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

27S29ADM/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES NOMINAL IN, body_height: 0.130 INCHES NOMINAL IN, body_length: 1.060 INCHES MAXIMUM IN, memory_capacity: 512 X 8, features_provided: BIPOLAR AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-549-3681, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

27S29ADM/B

NSN: 5962-01-549-3681
FSC: 5962 — Microcircuits, Electronic
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)

SPECIFICATIONS

body_width	0.300 INCHES NOMINAL IN
body_height	0.130 INCHES NOMINAL IN
body_length	1.060 INCHES MAXIMUM IN
memory_capacity	512 X 8
features_provided	BIPOLAR AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	F-15 AIRCRAFT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-549-3681

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.300 INCHES NOMINAL IN

•

BODY HEIGHT: 0.130 INCHES NOMINAL IN

•

FEATURES PROVIDED: BIPOLAR AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 165.00 MILLIAMPERES MAXIMUM SUPPLY

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.300 INCHES NOMINAL IN
BODY HEIGHT	0.130 INCHES NOMINAL IN
FEATURES PROVIDED	BIPOLAR AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND 3-STATE OUTPUT AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	165.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.060 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

4038322-429Reference document

Same NSN cross-reference

Reference document — Vendor item drawing reference

ROM/PROM HEAD 277Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 27S29ADM/B?

27S29ADM/B is a MICROCIRCUIT,MEMORY.

What parts can replace 27S29ADM/B?

There are 2 known substitutes for 27S29ADM/B: 4038322-429, ROM/PROM HEAD 277. Substitute compatibility should be verified for your specific system.

What is the NSN for 27S29ADM/B?

27S29ADM/B is cataloged in the U.S. Government catalog under NSN 5962-01-549-3681. This indicates validated use in U.S. government and defense supply chains.

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