27LS00FM/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

27LS00FM/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-054-5746, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

27LS00FM/B

NSN: 5962-01-054-5746
NIINs: 010545746, 012471359
FSC: 5962 — Microcircuits, Electronic
CAGE: 3V146 — ROCHESTER ELECTRONICS LLC (USA)

SPECIFICATIONS

body_width	0.285 INCHES MAXIMUM IN
body_height	0.085 INCHES MAXIMUM IN
body_length	0.440 INCHES MAXIMUM IN
features_provided	MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
precious_material	GOLD
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
NSN	5962-01-054-5746

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/STORAGE

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND SCHOTTKY AND 3-STATE OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/STORAGE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	-0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 27LS00FM/B?

27LS00FM/B is a MICROCIRCUIT,MEMORY.

What is the NSN for 27LS00FM/B?

27LS00FM/B is cataloged in the U.S. Government catalog under NSN 5962-01-054-5746. This indicates validated use in U.S. government and defense supply chains.

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27LS00FM/B — MICROCIRCUIT,MEMORY

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