2663203G001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

2663203G001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND HYBRID, inclosure_material: METAL, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, input_circuit_pattern: 64 INPUT AND 9 INPUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-365-2265, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

2663203G001

NSN: 5962-01-365-2265
FSC: 5962 — Microcircuits, Electronic
CAGE: 28527 — L3HARRIS TECHNOLOGIES, INC. (USA)

SPECIFICATIONS

features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND HYBRID
inclosure_material	METAL
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	64 INPUT AND 9 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	94 FLAT LEADS
voltage_rating_and_type_per_characteristic	5.5 VOLTS NOMINAL POWER SOURCE
NSN	5962-01-365-2265

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 64 INPUT AND 9 INPUT

•

INCLOSURE MATERIAL: METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND HYBRID

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: PAL

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	64 INPUT AND 9 INPUT
INCLOSURE MATERIAL	METAL
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND HYBRID
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PAL
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	94 FLAT LEADS

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

2663303G001Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 2663203G001?

2663203G001 is a MICROCIRCUIT,MEMORY.

What parts can replace 2663203G001?

There is 1 known substitute for 2663203G001: 2663303G001. Substitute compatibility should be verified for your specific system.

What is the NSN for 2663203G001?

2663203G001 is cataloged in the U.S. Government catalog under NSN 5962-01-365-2265. This indicates validated use in U.S. government and defense supply chains.

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2663203G001 — MICROCIRCUIT,MEMORY

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