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Technical Data Sheet
PartsTable / COMPONENT / 264-475692-002
264-475692-002 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.590 INCHES NOMINAL IN, body_height: 0.200 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, features_provided: PROGRAMMED AND STATIC OPERATION AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-086-2717, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
264-475692-002
NSN: 5962-01-086-2717
FSC: 5962
CAGE: 90073 — CMC ELECTRONICS INC (CAN)
SPECIFICATIONS
body_width0.590 INCHES NOMINAL IN
body_height0.200 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
bit_quantity16384
word_quantity2048
features_providedPROGRAMMED AND STATIC OPERATION AND ULTRAVIOLET ERASABLE AND HERMETICALLY SEALED
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
NSN5962-01-086-2717
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 264-475692-002 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
•
MEMORY DEVICE TYPE: ROM
•
MAXIMUM POWER DISSIPATION RATING: 540.0 MILLIWATTS
•
BIT QUANTITY: 16384
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
BODY WIDTH: 0.590 INCHES NOMINAL IN
•
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
MEMORY DEVICE TYPEROM
MAXIMUM POWER DISSIPATION RATING540.0 MILLIWATTS
BIT QUANTITY16384
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
BODY WIDTH0.590 INCHES NOMINAL IN
INCLOSURE MATERIALCERAMIC
BODY LENGTH1.290 INCHES MAXIMUM IN
OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 16
86327Interchangeable
interchangeable cross-reference
interchangeable
213Z111U01Interchangeable
interchangeable cross-reference
interchangeable
TMS2716-45JLInterchangeable
interchangeable cross-reference
interchangeable
MD2716Interchangeable
interchangeable cross-reference
interchangeable
3310-0402Interchangeable
interchangeable cross-reference
interchangeable
810AS829Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 264-475692-002?
264-475692-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 264-475692-002?
There are 16 known substitutes for 264-475692-002: 86327, 213Z111U01, TMS2716-45JL and 13 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 264-475692-002?
264-475692-002 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-086-2717. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026