26-1164: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include cushion: NOT INCLUDED, mounting_pad: NOT INCLUDED, overall_width: 0.375 INCHES NOMINAL IN, overall_length: 0.880 INCHES NOMINAL IN, special_features: 6.250 IN. H; 3.500 IN.
W; 14.500 IN. L; FOR USE EXTERNALLY; HANDLES 184K,DOUBLE DENSITY,40 TRACK,5.250 IN. DISKS IN, style_designator: STRAIGHT ARCH.
This part is cataloged in the U.S. Government catalog under NSN 5961-01-079-7495, indicating validated use in U.S. government and defense logistics supply chains.
Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| cushion | NOT INCLUDED |
| material | PLASTIC POLYHEXAMETHYLENE AMIDE OR PLASTIC POLYHEXAMETHYLENE ADIPAMIDE OR PLASTIC POLYCAPROLACTAM OR PLASTIC POLYHEXAMETHYLENE SEBACAMIDE LOCATION NOT OTHERWISE SPECIFIED |
| mounting_pad | NOT INCLUDED |
| overall_width | 0.375 INCHES NOMINAL IN |
| overall_length | 0.880 INCHES NOMINAL IN |
| special_features | 6.250 IN. H; 3.500 IN. W; 14.500 IN. L; FOR USE EXTERNALLY; HANDLES 184K,DOUBLE DENSITY,40 TRACK,5.250 IN. DISKS IN |
| style_designator | STRAIGHT ARCH |
| material_thickness | 0.040 INCHES NOMINAL IN |
| mounting_hole_size | 0.125 INCHES MINIMUM AND 0.130 INCHES MAXIMUM IN |
| inside_diameter/arch_length | 0.140 INCHES NOMINAL IN |
| distance_between_mounting_hole_centers | 0.555 INCHES MINIMUM AND 0.565 INCHES MAXIMUM IN |
| distance_between_base_and_inside_of_arch | 0.125 INCHES NOMINAL IN |
| NSN | 5961-01-079-7495 |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
No substitute or cross-reference records for this part.