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2584809 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

2584809: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 2520-00-451-4646, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
2584809
NSN: 2520-00-451-4646
NIINs: 004514646, 013736592
FSC: 2520 — Vehicular Power Transmission Components
CAGE: 80064 — NAVAL SHIP SYSTEMS COMMAND (USA)
SPECIFICATIONS
features_providedULTRAVIOLET ERASABLE AND PROGRAMMED AND MONOLITHIC
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern22 INPUT
hybrid_technology_typeMONOLITHIC
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
specification/standard_data67268-5962-8753901KA GOVERNMENT STANDARD AND 94987-258480-9 MANUFACTURERS SOURCE CONTROL
time_rating_per_chacteristic25.00 NANOSECONDS NOMINAL ACCESS NS
NSN2520-00-451-4646
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 2584809 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
GENERAL CHARACTERISTICS ITEM DESCRIPTION: STEEL,GRADE A,SPEC QQ-S-741 OR STEEL,CARBON,1010 THRU 1025,CF OR CD,SPEC ASTM A108;CADMIUM PLATE TYPE II CL 3 QQ-P-416;2.500 IN. DIA;0.500 IN. THK;1.084 TO 1.094 IN. BORE;MICROINCH FINISH 125 IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
GENERAL CHARACTERISTICS ITEM DESCRIPTIONSTEEL,GRADE A,SPEC QQ-S-741 OR STEEL,CARBON,1010 THRU 1025,CF OR CD,SPEC ASTM A108;CADMIUM PLATE TYPE II CL 3 QQ-P-416;2.500 IN. DIA;0.500 IN. THK;1.084 TO 1.094 IN. BORE;MICROINCH FINISH 125 IN
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 2584809?
2584809 is a MICROCIRCUIT,MEMORY.
What is the NSN for 2584809?
2584809 is cataloged in the U.S. Government catalog under NSN 2520-00-451-4646. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.