258-0007-030 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

258-0007-030: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.320 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 1.220 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.335 INCHES MAXIMUM IN, overall_length: 1.220 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-296-6833, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

258-0007-030

NSN: 5962-01-296-6833
FSC: 5962 — Microcircuits, Electronic
CAGE: 13499 — ROCKWELL COLLINS, INC. DBA COLLINS AEROSPACE GOVERNMENT SYSTEMS DIV COLLINS AEROSPACE - GOVERNMENT SYSTEMS (USA)

SPECIFICATIONS

body_width	0.320 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	1.220 INCHES MAXIMUM IN
overall_width	0.320 INCHES MAXIMUM IN
overall_height	0.335 INCHES MAXIMUM IN
overall_length	1.220 INCHES MAXIMUM IN
features_provided	BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-296-6833

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 18 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.320 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.335 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	18 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.320 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
OVERALL LENGTH	1.220 INCHES MAXIMUM IN
OVERALL WIDTH	0.320 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	DUAL-IN-LINE

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

IDT7198S55CBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 258-0007-030?

258-0007-030 is a MICROCIRCUIT,MEMORY.

What parts can replace 258-0007-030?

There is 1 known substitute for 258-0007-030: IDT7198S55CB. Substitute compatibility should be verified for your specific system.

What is the NSN for 258-0007-030?

258-0007-030 is cataloged in the U.S. Government catalog under NSN 5962-01-296-6833. This indicates validated use in U.S. government and defense supply chains.

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