2554961: LINK ASSY,SWEEP.
The LINK ASSY,SWEEP is a the manufacturer industrial component. Key specifications include material: CERAMIC CASE, body_style: CHIP TYPE, body_width: 0.126 INCHES NOMINAL IN, body_height: 0.080 INCHES MAXIMUM IN, body_length: 0.177 INCHES NOMINAL IN, reliability_indicator: NOT ESTABLISHED. This part is cataloged in the U.S.
Government catalog under NSN 1075-00-932-1588, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC CASE |
| body_style | CHIP TYPE |
| body_width | 0.126 INCHES NOMINAL IN |
| body_height | 0.080 INCHES MAXIMUM IN |
| body_length | 0.177 INCHES NOMINAL IN |
| reliability_indicator | NOT ESTABLISHED |
| nonderated_operating_temp | -55.0 CELSIUS MINIMUM AND 125.0 CELSIUS MAXIMUM DEGC |
| terminal_type_and_quantity | 2 BONDING PAD |
| tolerance_range_per_section | -10.00 TO 10.00 PERCENT SINGLE SECTION |
| schematic_diagram_designator | NO COMMON OR GROUNDED ELECTRODE(S) |
| capacitance_value_per_section | 0.100 MICROFARADS SINGLE SECTION |
| insulation_resistance_at_reference_temp | 10000.0 MEGOHMS |
| NSN | 1075-00-932-1588 |