252-400944-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

252-400944-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.220 INCHES MAXIMUM IN, body_length: 0.860 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: DYNAMIC AND 3-STATE OUTPUT AND LOW POWER, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-138-3372, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

252-400944-001

NSN: 5962-01-138-3372
FSC: 5962 — Microcircuits, Electronic
CAGE: 20886 — COMPRO COMPUTER SERVICES, INC. DBA COMPRO (USA)

SPECIFICATIONS

body_width	0.290 INCHES NOMINAL IN
body_height	0.220 INCHES MAXIMUM IN
body_length	0.860 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	DYNAMIC AND 3-STATE OUTPUT AND LOW POWER
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 55.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-138-3372

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES NOMINAL IN

•

BODY HEIGHT: 0.220 INCHES MAXIMUM IN

•

FEATURES PROVIDED: DYNAMIC AND 3-STATE OUTPUT AND LOW POWER

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES NOMINAL IN
BODY HEIGHT	0.220 INCHES MAXIMUM IN
FEATURES PROVIDED	DYNAMIC AND 3-STATE OUTPUT AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.860 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 4

252-400944Reference document

Same NSN cross-reference

Reference document — Secondary reference

416C-5-010BReference document

Same NSN cross-reference

Reference document — Secondary reference

MK4116N-91Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ZA0944NReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 252-400944-001?

252-400944-001 is a MICROCIRCUIT,MEMORY.

What parts can replace 252-400944-001?

There are 4 known substitutes for 252-400944-001: 252-400944, 416C-5-010B, MK4116N-91 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 252-400944-001?

252-400944-001 is cataloged in the U.S. Government catalog under NSN 5962-01-138-3372. This indicates validated use in U.S. government and defense supply chains.

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252-400944-001 — MICROCIRCUIT,MEMORY

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