247ASC2520-006 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

247ASC2520-006: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND HERMETICALLY SEALED AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-068-3310, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

247ASC2520-006

NSN: 5962-01-068-3310
FSC: 5962 — Microcircuits, Electronic
CAGE: 30003 — NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND HERMETICALLY SEALED AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR GLASS OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-068-3310

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED AND HERMETICALLY SEALED AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC OR GLASS OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED AND HERMETICALLY SEALED AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

HPR0M-1-1024-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

TM5623MDE/883CReference document

Same NSN cross-reference

Reference document — Secondary reference

DM7574J/883CReference document

Same NSN cross-reference

Reference document — Secondary reference

S82S129F/883CReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 247ASC2520-006?

247ASC2520-006 is a MICROCIRCUIT,MEMORY.

What parts can replace 247ASC2520-006?

There are 4 known substitutes for 247ASC2520-006: HPR0M-1-1024-8, TM5623MDE/883C, DM7574J/883C and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 247ASC2520-006?

247ASC2520-006 is cataloged in the U.S. Government catalog under NSN 5962-01-068-3310. This indicates validated use in U.S. government and defense supply chains.

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