The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: CARBON SEALING ELEMENT, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, case_style: FLANGED, seal_width: 0.610 INCHES NOMINAL IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.090 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-188-8923, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CARBON SEALING ELEMENT |
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| case_style | FLANGED |
| seal_width | 0.610 INCHES NOMINAL IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.090 INCHES MAXIMUM IN |
| first_leg_style | END RADIUS |
| second_leg_style | END RADIUS |
| style_designator | OFFSET ANGLE |
| features_provided | PROGRAMMED AND HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| NSN | 5962-01-188-8923 |