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Technical Data Sheet
2394553G8 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND AC COUPLED AND RESETTABLE AND W/BUFFERED OUTPUT AND NEGATIVE OUTPUTS, output_logic_form: EMITTER-COUPLED LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-945-7940, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
2394553G8
NSN: 5962-00-945-7940
FSC: 5962
CAGE: 28527 — L3HARRIS TECHNOLOGIES, INC. (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN
features_providedMONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND AC COUPLED AND RESETTABLE AND W/BUFFERED OUTPUT AND NEGATIVE OUTPUTS
output_logic_formEMITTER-COUPLED LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity10 FLAT LEADS
NSN5962-00-945-7940
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 2394553G8 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
BODY LENGTH: 0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATION: FLAT PACK
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
CASE OUTLINE SOURCE AND DESIGNATOR: T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
TERMINAL SURFACE TREATMENT: SOLDER
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND AC COUPLED AND RESETTABLE AND W/BUFFERED OUTPUT AND NEGATIVE OUTPUTS
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
TECHNICAL CHARACTERISTICS (FLIS)
BODY LENGTH0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONFLAT PACK
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
CASE OUTLINE SOURCE AND DESIGNATORT0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND AC COUPLED AND RESETTABLE AND W/BUFFERED OUTPUT AND NEGATIVE OUTPUTS
BODY WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY10 FLAT LEADS
INPUT CIRCUIT PATTERN6 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
SN126960UInterchangeable
interchangeable cross-reference
interchangeable
SC20533FH1Interchangeable
interchangeable cross-reference
interchangeable
SMB586428Interchangeable
interchangeable cross-reference
interchangeable
MC361GInterchangeable
interchangeable cross-reference
interchangeable
DMS 76002BInterchangeable
interchangeable cross-reference
interchangeable
MC1024PInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusCANCELLED
Availability
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 2394553G8?
2394553G8 is a MICROCIRCUIT,DIGITAL.
What parts can replace 2394553G8?
There are 23 known substitutes for 2394553G8: SN126960U, SC20533FH1, SMB586428 and 20 more. Substitute compatibility should be verified for your specific system.
Is 2394553G8 still available?
2394553G8 is currently cancelled.
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