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2387167-1 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

2387167-1: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: EMITTER-COUPLED LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-097-7496, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
2387167-1
NSN: 5962-01-097-7496
FSC: 5962 — Microcircuits, Electronic
CAGE: 49671 — LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN DIV LOCKHEED MARTIN (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
body_length0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formEMITTER-COUPLED LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-30.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern5 INPUT
end_item_identificationRECEIVING SET,SPECIAL PURPOSE,TYPE AN/MSQ-103
inclosure_configurationFLAT PACK
NSN5962-01-097-7496
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 2387167-1 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 5 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 FLIP-FLOP, D-TYPE
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
•
INCLOSURE CONFIGURATION: FLAT PACK
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN5 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 FLIP-FLOP, D-TYPE
BODY WIDTH0.245 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT0.060 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATIONFLAT PACK
BODY LENGTH0.370 INCHES MINIMUM AND 0.400 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 6
MC1670BFBJCReference document
Same NSN cross-reference
Reference document — Secondary reference
1670/BFBJCReference document
Same NSN cross-reference
Reference document — Secondary reference
93572Reference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
351-7471-040Reference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
1670/BFAJCReference document
Same NSN cross-reference
Reference document — Design control — primary reference
SC8353SReference document
Same NSN cross-reference
Reference document — Replaced / superseded reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 2387167-1?
2387167-1 is a MICROCIRCUIT,DIGITAL.
What parts can replace 2387167-1?
There are 6 known substitutes for 2387167-1: MC1670BFBJC, 1670/BFBJC, 93572 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 2387167-1?
2387167-1 is cataloged in the U.S. Government catalog under NSN 5962-01-097-7496. This indicates validated use in U.S. government and defense supply chains.
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