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Technical Data Sheet
PartsTable / COMPONENT / 23-368A2-00
23-368A2-00 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.175 INCHES MAXIMUM IN, body_height: 0.300 INCHES MAXIMUM IN, body_length: 0.790 INCHES MAXIMUM IN, overall_width: 0.320 INCHES MAXIMUM IN, overall_height: 0.355 INCHES MAXIMUM IN, overall_length: 0.790 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-133-7148, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
23-368A2-00
NSN: 5962-01-133-7148
FSC: 5962
CAGE: 15476 — COMPAQ FEDERAL LLC (USA)
SPECIFICATIONS
body_width0.175 INCHES MAXIMUM IN
body_height0.300 INCHES MAXIMUM IN
body_length0.790 INCHES MAXIMUM IN
overall_width0.320 INCHES MAXIMUM IN
overall_height0.355 INCHES MAXIMUM IN
overall_length0.790 INCHES MAXIMUM IN
features_providedBURN IN AND LOW CURRENT AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
NSN5962-01-133-7148
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 23-368A2-00 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
BODY WIDTH: 0.175 INCHES MAXIMUM IN
•
INCLOSURE MATERIAL: CERAMIC
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
FEATURES PROVIDED: BURN IN AND LOW CURRENT AND SCHOTTKY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
BODY WIDTH0.175 INCHES MAXIMUM IN
INCLOSURE MATERIALCERAMIC
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
FEATURES PROVIDEDBURN IN AND LOW CURRENT AND SCHOTTKY
BODY HEIGHT0.300 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN11 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 8
1816-0268Interchangeable
interchangeable cross-reference
interchangeable
08660-80019Interchangeable
interchangeable cross-reference
interchangeable
SN74S287NInterchangeable
interchangeable cross-reference
interchangeable
1816-0423Interchangeable
interchangeable cross-reference
interchangeable
SN92489NInterchangeable
interchangeable cross-reference
interchangeable
08660-80022Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 23-368A2-00?
23-368A2-00 is a MICROCIRCUIT,MEMORY.
What parts can replace 23-368A2-00?
There are 8 known substitutes for 23-368A2-00: 1816-0268, 08660-80019, SN74S287N and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 23-368A2-00?
23-368A2-00 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-133-7148. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026