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Technical Data Sheet
23-122A1-00 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MAXIMUM IN, body_height: 0.145 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, bit_quantity: 256, word_quantity: 32, features_provided: MONOLITHIC AND BIPOLAR AND W/ENABLE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-129-3996, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
23-122A1-00
NSN: 5962-01-129-3996
FSC: 5962
CAGE: 15476 — COMPAQ FEDERAL LLC (USA)
SPECIFICATIONS
body_width0.290 INCHES MAXIMUM IN
body_height0.145 INCHES MAXIMUM IN
body_length0.785 INCHES MAXIMUM IN
bit_quantity256
word_quantity32
features_providedMONOLITHIC AND BIPOLAR AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialPLASTIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
NSN5962-01-129-3996
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 23-122A1-00 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
CURRENT RATING PER CHARACTERISTIC: 77.00 MILLIAMPERES MAXIMUM SUPPLY
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENT: SOLDER
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH: 0.290 INCHES MAXIMUM IN
INCLOSURE MATERIAL: PLASTIC
WORD QUANTITY: 32
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
CURRENT RATING PER CHARACTERISTIC77.00 MILLIAMPERES MAXIMUM SUPPLY
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY WIDTH0.290 INCHES MAXIMUM IN
INCLOSURE MATERIALPLASTIC
WORD QUANTITY32
MEMORY DEVICE TYPEPROM
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
CAPITANCE RATING PER CHARACTERISTIC5.00 INPUT PICOFARADS NOMINAL AND 8.00 OUTPUT PICOFARADS NOMINAL
VERIFIED SUBSTITUTES & CROSS-REFERENCES 19
807739-055A58Interchangeable
interchangeable cross-reference
interchangeable
N82S123NInterchangeable
interchangeable cross-reference
interchangeable
63S081NInterchangeable
interchangeable cross-reference
interchangeable
SN74S288NInterchangeable
interchangeable cross-reference
interchangeable
IM5610CP(J)EInterchangeable
interchangeable cross-reference
interchangeable
807739-055A59Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 23-122A1-00?
23-122A1-00 is a MICROCIRCUIT,MEMORY.
What parts can replace 23-122A1-00?
There are 19 known substitutes for 23-122A1-00: 807739-055A58, N82S123N, 63S081N and 16 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 23-122A1-00?
23-122A1-00 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-129-3996. This indicates validated use in U.S. government and defense supply chains.
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