22956: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: RUBBER SYNTHETIC, design_type: SINGLE CENTRALLY LOCATED HOLE, body_diameter: 0.750 INCHES NOMINAL IN, overall_length: 0.515 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN, major_components: MTG FACILITY 1, style_designator: ROUND. This part is cataloged in the U.S.
Government catalog under NSN 4330-00-414-6301, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | RUBBER SYNTHETIC |
| design_type | SINGLE CENTRALLY LOCATED HOLE |
| body_diameter | 0.750 INCHES NOMINAL IN |
| overall_length | 0.515 INCHES MINIMUM AND 0.520 INCHES MAXIMUM IN |
| major_components | MTG FACILITY 1 |
| style_designator | ROUND |
| center_hole_diameter | 0.250 INCHES MINIMUM AND 0.252 INCHES MAXIMUM IN |
| general_characteristics_item_description | BRONZE,5-1/4 IN.O/AH2-3/4 IN.W,1-15/16 IN. LG,2MTG HOLES,11/16 IN. LG,2 MOT HOLES,11/16 IN.DIA,3-7/8 IN.C TO C,1-17/32 IN.DIA BORE IN |
| NSN | 4330-00-414-6301 |
| GENERAL CHARACTERISTICS ITEM DESCRIPTION | BRONZE,5-1/4 IN.O/AH2-3/4 IN.W,1-15/16 IN. LG,2MTG HOLES,11/16 IN. LG,2 MOT HOLES,11/16 IN.DIA,3-7/8 IN.C TO C,1-17/32 IN.DIA BORE IN |