The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include inclosure_material: SILICON, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, input_circuit_pattern: 2 INPUT, inclosure_configuration: CAN, terminal_surface_treatment: SOLDER. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-038-3357, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| inclosure_material | SILICON |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| design_function_and_quantity | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| maximum_power_dissipation_rating | 300.0 MILLIWATTS |
| NSN | 5962-01-038-3357 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| INCLOSURE CONFIGURATION | CAN |
| INCLOSURE MATERIAL | SILICON |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| TERMINAL SURFACE TREATMENT | SOLDER |