226282-019 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

226282-019: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.505 INCHES NOMINAL IN, body_height: 0.045 INCHES NOMINAL IN, body_length: 0.550 INCHES NOMINAL IN, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-321-1844, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

226282-019

NSN: 5962-00-321-1844
FSC: 5962 — Microcircuits, Electronic
CAGE: 5X304 — FALCON ELECTRONICS, INC. (USA)

SPECIFICATIONS

body_width	0.505 INCHES NOMINAL IN
body_height	0.045 INCHES NOMINAL IN
body_length	0.550 INCHES NOMINAL IN
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 110.0 CELSIUS DEGC
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	24 FLAT LEADS
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-00-321-1844

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.505 INCHES NOMINAL IN

•

BODY HEIGHT: 0.045 INCHES NOMINAL IN

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: PROM

•

BODY LENGTH: 0.550 INCHES NOMINAL IN

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.505 INCHES NOMINAL IN
BODY HEIGHT	0.045 INCHES NOMINAL IN
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.550 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 110.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

PR0M0512G0026Reference document

Same NSN cross-reference

Reference document — Secondary reference

SN37877Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 226282-019?

226282-019 is a MICROCIRCUIT,MEMORY.

What parts can replace 226282-019?

There are 2 known substitutes for 226282-019: PR0M0512G0026, SN37877. Substitute compatibility should be verified for your specific system.

What is the NSN for 226282-019?

226282-019 is cataloged in the U.S. Government catalog under NSN 5962-00-321-1844. This indicates validated use in U.S. government and defense supply chains.

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226282-019 — MICROCIRCUIT,MEMORY

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