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Technical Data Sheet
PartsTable / COMPONENT / 210708-003
210708-003 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND ELECTROSTATIC SENSITIVE AND MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: PROM. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-341-5904, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
210708-003
NSN: 5962-01-341-5904
FSC: 5962
CAGE: 09344 — ROCKWELL COLLINS, INC. DBA RC DISPLAYS SYSTEMS (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
features_providedPROGRAMMED AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96096-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-341-5904
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 210708-003 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
MEMORY DEVICE TYPE: PROM
•
CURRENT RATING PER CHARACTERISTIC: 195.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEPROM
CURRENT RATING PER CHARACTERISTIC195.00 MILLIAMPERES MAXIMUM SUPPLY
PART NAME ASSIGNED BY CONTROLLING AGENCYSIN/COS PROMS,STROKE GENERATOR
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 9
ROM/PROM FAMILY 215Interchangeable
interchangeable cross-reference
interchangeable
210708-001Interchangeable
interchangeable cross-reference
interchangeable
PC73896-1Interchangeable
interchangeable cross-reference
interchangeable
210708-002Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
210718-001Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 210708-003?
210708-003 is a MICROCIRCUIT,MEMORY.
What parts can replace 210708-003?
There are 9 known substitutes for 210708-003: ROM/PROM FAMILY 215, 210708-001, PC73896-1 and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 210708-003?
210708-003 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-341-5904. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026