Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 210703-003

210703-003 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN, body_length: 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, features_provided: ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-350-9553, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

210703-003

NSN: 5962-01-350-9553
FSC: 5962
CAGE: 09344 — ROCKWELL COLLINS, INC. DBA RC DISPLAYS SYSTEMS (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
body_length	1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
features_provided	ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-350-9553

COMPONENT DIAGRAM

KEY FEATURES

•

BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN

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STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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MEMORY DEVICE TYPE: EPROM

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TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT

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TERMINAL SURFACE TREATMENT: SOLDER

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OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

BODY HEIGHT	0.130 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	EPROM
TERMINAL TYPE AND QUANTITY	24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT	SOLDER
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC

VERIFIED SUBSTITUTES & CROSS-REFERENCES 12

210655-005Interchangeable