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210-2155-010 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

210-2155-010: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: HARDNESS CRITICAL PROCESS, features_provided: PROGRAMMED, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: INTERCOM SET, FSCM 76823, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-434-3246, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
210-2155-010
NSN: 5962-01-434-3246
NIINs: 014343246, 014343247, 014343248, 014343250, 014343251, 014343252, 014343253, 014486652, 014486655, 014486656, 014486666, 014486669, 014486670, 014486671
FSC: 5962 — Microcircuits, Electronic
CAGE: 95105 — ROCKWELL COLLINS, INC. DIV COLLINS AEROSPACE - MISSION SYSTEMS (USA)
SPECIFICATIONS
special_featuresHARDNESS CRITICAL PROCESS
features_providedPROGRAMMED
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
end_item_identificationINTERCOM SET, FSCM 76823
inclosure_configurationDUAL-IN-LINE
criticality_code_justificationFEAT
nuclear_hardness_critical_featureHARDENED
part_name_assigned_by_controlling_agencyPROGRAMMED EPROM
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-434-3246
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 210-2155-010 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED EPROM
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
NUCLEAR HARDNESS CRITICAL FEATUREHARDENED
SUBSTITUTES & CROSS-REFERENCES 3
751-7624-010Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
NH751-7624-010Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 210-2155-010?
210-2155-010 is a MICROCIRCUIT,MEMORY.
What parts can replace 210-2155-010?
There are 3 known substitutes for 210-2155-010: 751-7624-010, ROM/PROM, NH751-7624-010. Substitute compatibility should be verified for your specific system.
What is the NSN for 210-2155-010?
210-2155-010 is cataloged in the U.S. Government catalog under NSN 5962-01-434-3246. This indicates validated use in U.S. government and defense supply chains.
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