2089272: SOCKET,PLUG-IN ELECTRONIC COMPON.
SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, mounting_method: PRESS FIT, features_provided: COMPONENT RETAINING DEVICE, polarization_type: CONTACT POSITION, surface_treatment: SILVER CONTACT, fabrication_method: MOLDED. This part is cataloged in the U.S.
Government catalog under NSN 5935-00-932-2966, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| mounting_method | PRESS FIT |
| features_provided | COMPONENT RETAINING DEVICE |
| polarization_type | CONTACT POSITION |
| surface_treatment | SILVER CONTACT |
| fabrication_method | MOLDED |
| mounting_hole_style | ROUND, FLATTED |
| terminal_type_and_quantity | 3 TAB, SOLDER LUG |
| accommodated_contact_quantity | 3 |
| specific_equipment_accommodated | SEMICONDUCTOR DEVICE |
| mounting_type_for_which_designed | CHASSIS |
| contact_position_arrangement_style | CIRCULAR IRREGULAR 0.100 INCH IN |
| NSN | 5935-00-932-2966 |
| DISTANCE FROM FLATTED PORTION TO OPPOSITE SURFACE | 0.232 INCHES NOMINAL IN |
| MOUNTING HOLE STYLE | ROUND, FLATTED |
| ACCOMMODATED CONTACT QUANTITY | 3 |
| MOUNTING METHOD | PRESS FIT |
| BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.252 INCHES NOMINAL IN |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| FEATURES PROVIDED | COMPONENT RETAINING DEVICE |
| POLARIZATION TYPE | CONTACT POSITION |
| CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR IRREGULAR 0.100 INCH IN |
| SURFACE TREATMENT | SILVER CONTACT |