208903-1: TERMINAL,LUG.
The TERMINAL,LUG is a the manufacturer industrial component. Key specifications include material: COPPER CONDUCTOR ACCOMMODATION, basic_shape_style: SOLDER/SOLDERLESS, surface_treatment: TIN CONDUCTOR ACCOMMODATION SINGLE LAYER, material_thickness: 0.020 INCHES IN, mounting_slot_width: 0.117 INCHES IN, mounting_method_style: OPEN SLOT. This part is cataloged in the U.S.
Government catalog under NSN 5940-00-177-6542, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER CONDUCTOR ACCOMMODATION |
| basic_shape_style | SOLDER/SOLDERLESS |
| surface_treatment | TIN CONDUCTOR ACCOMMODATION SINGLE LAYER |
| material_thickness | 0.020 INCHES IN |
| mounting_slot_width | 0.117 INCHES IN |
| mounting_method_style | OPEN SLOT |
| mounting_facility_thickness | 0.020 INCHES IN |
| electrical_insulation_feature | UNINSULATED |
| maximum_conductor_size_accommodated | 13 AWG |
| NSN | 5940-00-177-6542 |
| MOUNTING FACILITY THICKNESS | 0.020 INCHES IN |
| MOUNTING SLOT WIDTH | 0.117 INCHES IN |
| MAXIMUM CONDUCTOR SIZE ACCOMMODATED | 13 AWG |
| BASIC SHAPE STYLE | SOLDER/SOLDERLESS |
| MOUNTING METHOD STYLE | OPEN SLOT |
| ELECTRICAL INSULATION FEATURE | UNINSULATED |
| SURFACE TREATMENT | TIN CONDUCTOR ACCOMMODATION SINGLE LAYER |
| SURFACE TREATMENT | TIN MOUNTING FACILITY SINGLE LAYER |
| MATERIAL | COPPER CONDUCTOR ACCOMMODATION |
| MATERIAL | COPPER MOUNTING FACILITY |
No substitute or cross-reference records for this part.