205-0059-001 — MICROCIRCUIT ASSEMBLY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

205-0059-001: MICROCIRCUIT ASSEMBLY.

The MICROCIRCUIT ASSEMBLY is a the manufacturer industrial component. Key specifications include body_width: 0.999 INCHES NOMINAL IN, body_height: 0.170 INCHES NOMINAL IN, body_length: 0.999 INCHES NOMINAL IN, special_features: NUCLEAR HARDNESS CRITICAL ITEMS, features_provided: HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-356-6553, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

205-0059-001

NSN: 5962-01-356-6553
FSC: 5962 — Microcircuits, Electronic
CAGE: 66847 — DPAC TECHNOLOGIES CORP. (USA)

SPECIFICATIONS

body_width	0.999 INCHES NOMINAL IN
body_height	0.170 INCHES NOMINAL IN
body_length	0.999 INCHES NOMINAL IN
special_features	NUCLEAR HARDNESS CRITICAL ITEMS
features_provided	HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	31 PIN
NSN	5962-01-356-6553

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.999 INCHES NOMINAL IN

•

BODY HEIGHT: 0.170 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION

•

MICROCIRCUIT DEVICE TYPE AND QUANTITY: 4 MEMORY

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 0.999 INCHES NOMINAL IN

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.999 INCHES NOMINAL IN
BODY HEIGHT	0.170 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION
MICROCIRCUIT DEVICE TYPE AND QUANTITY	4 MEMORY
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.999 INCHES NOMINAL IN
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	NUCLEAR HARDNESS CRITICAL ITEMS

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

DPS 1X16-RBSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 205-0059-001?

205-0059-001 is a MICROCIRCUIT ASSEMBLY.

What parts can replace 205-0059-001?

There is 1 known substitute for 205-0059-001: DPS 1X16-RB. Substitute compatibility should be verified for your specific system.

What is the NSN for 205-0059-001?

205-0059-001 is cataloged in the U.S. Government catalog under NSN 5962-01-356-6553. This indicates validated use in U.S. government and defense supply chains.

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