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PartsTable / COMPONENT / 20348-025
20348-025 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.886 INCHES MAXIMUM IN, special_features: ITEM SOURCES OF SUPPLY ARE ALTERED BY PROGRAMMABLE DATA, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-096-8927, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
20348-025
NSN: 5962-01-096-8927
FSC: 5962
CAGE: 23094 — OCEAN TECHNOLOGY INC (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MAXIMUM IN
body_length0.886 INCHES MAXIMUM IN
special_featuresITEM SOURCES OF SUPPLY ARE ALTERED BY PROGRAMMABLE DATA
features_providedHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC OR GLASS OR METAL
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-096-8927
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 20348-025 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: ROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
•
INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL
•
BODY WIDTH: 0.310 INCHES MAXIMUM IN
•
BODY LENGTH: 0.886 INCHES MAXIMUM IN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
SPECIAL FEATURESITEM SOURCES OF SUPPLY ARE ALTERED BY PROGRAMMABLE DATA
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
INCLOSURE MATERIALCERAMIC OR GLASS OR METAL
BODY WIDTH0.310 INCHES MAXIMUM IN
BODY LENGTH0.886 INCHES MAXIMUM IN
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
BODY HEIGHT0.140 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 3
HP1-1024-8Interchangeable
Same NIIN cross-reference
interchangeable
DM7574J/883BInterchangeable
Same NIIN cross-reference
interchangeable
RB82S129FInterchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 20348-025?
20348-025 is a MICROCIRCUIT,MEMORY.
What parts can replace 20348-025?
There are 3 known substitutes for 20348-025: HP1-1024-8, DM7574J/883B, RB82S129F. Substitute compatibility should be verified for your specific system.
What is the NSN for 20348-025?
20348-025 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-096-8927. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026