20303-001: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include material: ALUMINUM ALLOY, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, lip_thickness: 0.250 INCHES NOMINAL IN, overall_height: 1.550 INCHES NOMINAL IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-361-8732, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | ALUMINUM ALLOY |
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| lip_thickness | 0.250 INCHES NOMINAL IN |
| overall_height | 1.550 INCHES NOMINAL IN |
| flange_diameter | 2.312 INCHES NOMINAL IN |
| flange_thickness | 0.125 INCHES NOMINAL IN |
| style_designator | IRREGULAR |
| end_hole_diameter | 0.625 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH VOLTAGE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| NSN | 5962-00-361-8732 |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH VOLTAGE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/8 GOVERNMENT SPECIFICATION |