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Technical Data Sheet
202104-001 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.270 INCHES NOMINAL IN, body_height: 0.150 INCHES NOMINAL IN, body_length: 0.760 INCHES NOMINAL IN, features_provided: HIGH SPEED AND PROGRAMMABLE AND EXPANDABLE AND BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-019-1109, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
202104-001
NSN: 5962-01-019-1109
FSC: 5962
CAGE: 81413 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)
SPECIFICATIONS
body_width0.270 INCHES NOMINAL IN
body_height0.150 INCHES NOMINAL IN
body_length0.760 INCHES NOMINAL IN
features_providedHIGH SPEED AND PROGRAMMABLE AND EXPANDABLE AND BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-019-1109
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 202104-001 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
BODY LENGTH: 0.760 INCHES NOMINAL IN
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN: 10 INPUT
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
MEMORY DEVICE TYPE: ROM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY LENGTH0.760 INCHES NOMINAL IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERN10 INPUT
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
INCLOSURE CONFIGURATIONDUAL-IN-LINE
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
INCLOSURE MATERIALCERAMIC
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES

No verified substitutes available.

LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 202104-001?
202104-001 is a MICROCIRCUIT,MEMORY.
What is the NSN for 202104-001?
202104-001 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-019-1109. This indicates validated use in U.S. government and defense supply chains.
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