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Technical Data Sheet

201693-B21 — Memory Specs & Substitutes

✓ Verified by PartsTable
HPE · MRO · MRO_GENERAL
WHAT YOU NEED TO KNOW
2Rx4 = Dual Rank ×4 chip width (standard server) RDIMM = Registered (servers) | LRDIMM = Load-Reduced (max density)
DDR3 ≠ DDR4 ≠ DDR5 — physically incompatible (notch position)
PRODUCT OVERVIEW

Memory is one of the most critical components in your server, and one of the easiest to upgrade to quickly enhance and improve overall system performance.The dependence on industry standard servers to run memory-intensive applications is pushing the memory capacity of servers to new levels. For server applications, memory modules and other server components must withstand almost non-stop exposure to elements such as heat and electricity. The slightest defect can become a problem resulting in server crashes and data loss for multiple users.

As server memory capacities increase, so does the likelihood of memory errors that can corrupt data and cause servers to crash. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-01-544-5995, indicating validated use in U.S. government and defense logistics supply chains.

WHERE IT FITS
MRO MRO_GENERAL 201693-B21
NSN: 5998-01-544-5995
FSC: 5998 — CIRCUIT CARD ASSEMBLY
CAGE: 65685 — COMPAQ COMPUTER CORP. (USA)
SPECIFICATIONS
functional_descriptionMEMORY CARD: 512MB, 133HMZ, ECC SDRAM, 2 X 256 MB MB
end_item_identification188-548-001(65685), SERVER,ML370R02 P1266-512US US
part_name_assigned_by_controlling_agencyINAVY: MEMORY OPTION KIT
NSN5998-01-544-5995
COMPONENT DIAGRAM
ECC 512MB 2Rx4 PC4 RDIMM HPE NOTCH ~133.35 mm DDR4 RDIMM | 512MB | — | PC4 Notch position = DDR4 generation | DDR3/DDR4/DDR5 physically incompatible RDIMM = Registered (servers) | LRDIMM = Load-Reduced | UDIMM = Unbuffered TITLE DDR4 RDIMM PN 201693-B21 MFR HPE 512MB —
KEY FEATURES
512MB Capacity
FUNCTIONAL DESCRIPTION: MEMORY CARD: 512MB, 133HMZ, ECC SDRAM, 2 X 256 MB MB
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
END ITEM IDENTIFICATION188-548-001(65685), SERVER,ML370R02 P1266-512US US
PART NAME ASSIGNED BY CONTROLLING AGENCYINAVY: MEMORY OPTION KIT
FUNCTIONAL DESCRIPTIONMEMORY CARD: 512MB, 133HMZ, ECC SDRAM, 2 X 256 MB MB
END ITEM IDENTIFICATION188-548-001(65685), SERVER,ML370R02 P1266-512US US
PART NAME ASSIGNED BY CONTROLLING AGENCYINAVY: MEMORY OPTION KIT
FUNCTIONAL DESCRIPTIONMEMORY CARD: 512MB, 133HMZ, ECC SDRAM, 2 X 256 MB MB
VERIFIED SUBSTITUTES & CROSS-REFERENCES

No verified substitutes available.

LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMATSourcing: other
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FREQUENTLY ASKED QUESTIONS
What is 201693-B21?
201693-B21 is a HP 512MB 133MHz SDRAM memory module 0.5 GB 2 x 0.25 GB 168-pin DIMM ECC manufactured by HPE. It is classified as a MRO (MRO_GENERAL).
What is the NSN for 201693-B21?
201693-B21 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-01-544-5995. This indicates validated use in U.S. government and defense supply chains.
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