The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, features_provided: ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER AND STATIC OPERATION. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-191-6699, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| bit_quantity | 16384 |
| word_quantity | 2048 |
| features_provided | ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER AND STATIC OPERATION |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 11 INPUT |
| NSN | 5962-01-191-6699 |
| WORD QUANTITY | 2048 |
| INCLOSURE MATERIAL | CERAMIC |
| MEMORY DEVICE TYPE | ROM |
| MAXIMUM POWER DISSIPATION RATING | 525.0 MILLIWATTS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND LOW POWER AND STATIC OPERATION |
| INPUT CIRCUIT PATTERN | 11 INPUT |