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2001260 — SEMICONDUCTOR DEVICE,PHOTO

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

2001260: SEMICONDUCTOR DEVICE,PHOTO.

The SEMICONDUCTOR DEVICE,PHOTO is a the manufacturer industrial component. Key specifications include overall_length: 0.220 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), terminal_length: 0.350 INCHES NOMINAL IN, overall_diameter: 0.800 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-374-5520, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
2001260
NSN: 5961-01-374-5520
NIINs: 013745520, 016275925
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 50486 — OSI OPTOELECTRONICS, INC DBA OSI OPTOELECTRONICS INC (USA)
SPECIFICATIONS
overall_length0.220 INCHES MAXIMUM IN
mounting_methodTHREADED STUD(S)
terminal_length0.350 INCHES NOMINAL IN
overall_diameter0.800 INCHES MAXIMUM IN
special_featuresJUNCTION PATTERN ARRANGEMENT: PN
features_providedHERMETICALLY SEALED CASE
nominal_thread_size0.112 INCHES IN
internal_configurationJUNCTION CONTACT
semiconductor_materialSILICON
thread_quantity_per_inch40
thread_series_designatorUNIFIED NATIONAL COARSE (UNC)
mounting_facility_quantity1
NSN5961-01-374-5520
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN 2001260 MFR OEM SEMICONDUCTOR DEVICE,PHOTO
KEY FEATURES
•
MOUNTING FACILITY QUANTITY: 1
•
OVERALL DIAMETER: 0.800 INCHES MAXIMUM IN
•
TERMINAL LENGTH: 0.350 INCHES NOMINAL IN
•
MOUNTING METHOD: THREADED STUD(S)
•
SEMICONDUCTOR MATERIAL: SILICON
•
INTERNAL CONFIGURATION: JUNCTION CONTACT
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
TECHNICAL CHARACTERISTICS
MOUNTING FACILITY QUANTITY1
OVERALL DIAMETER0.800 INCHES MAXIMUM IN
TERMINAL LENGTH0.350 INCHES NOMINAL IN
MOUNTING METHODTHREADED STUD(S)
SEMICONDUCTOR MATERIALSILICON
OVERALL LENGTH0.220 INCHES MAXIMUM IN
INTERNAL CONFIGURATIONJUNCTION CONTACT
FEATURES PROVIDEDHERMETICALLY SEALED CASE
NOMINAL THREAD SIZE0.112 INCHES IN
SPECIAL FEATURESJUNCTION PATTERN ARRANGEMENT: PN
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 2001260?
2001260 is a SEMICONDUCTOR DEVICE,PHOTO.
What is the NSN for 2001260?
2001260 is cataloged in the U.S. Government catalog under NSN 5961-01-374-5520. This indicates validated use in U.S. government and defense supply chains.
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