1U0664-8 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1U0664-8: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, special_features: NUCLEAR HARDNESS CRITICAL ITEM; TESTED TO 10.0K RAD, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND STATIC OPERATION, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-351-9520, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1U0664-8

NSN: 5962-01-351-9520
FSC: 5962 — Microcircuits, Electronic
CAGE: 11627 — L3 TECHNOLOGIES, INC. DIV COMMUNICATION SYSTEMS-WEST (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
special_features	NUCLEAR HARDNESS CRITICAL ITEM; TESTED TO 10.0K RAD
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND STATIC OPERATION
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-351-9520

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

CRITICALITY CODE JUSTIFICATION: FEAT

•

FEATURES PROVIDED: BURN IN AND ELECTROSTATIC SENSITIVE AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
CRITICALITY CODE JUSTIFICATION	FEAT
FEATURES PROVIDED	BURN IN AND ELECTROSTATIC SENSITIVE AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 1

IDT6167LA70DBRTReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1U0664-8?

1U0664-8 is a MICROCIRCUIT,MEMORY.

What parts can replace 1U0664-8?

There is 1 known substitute for 1U0664-8: IDT6167LA70DBRT. Substitute compatibility should be verified for your specific system.

What is the NSN for 1U0664-8?

1U0664-8 is cataloged in the U.S. Government catalog under NSN 5962-01-351-9520. This indicates validated use in U.S. government and defense supply chains.

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