The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.620 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN, mounting_method: PRESS FIT, terminal_length: 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_diameter: 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM IN, special_features: METER RECTIFIER UP TO 3000 MC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-617-4983, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.620 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| terminal_length | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| overall_diameter | 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM IN |
| special_features | METER RECTIFIER UP TO 3000 MC |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 1 FERRULE AND 1 FLANGE |
| specification/standard_data | 80131-RELEASE1303 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| NSN | 5961-00-617-4983 |
| SPECIFICATION/STANDARD DATA | 80131-RELEASE1303 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| SPECIAL FEATURES | METER RECTIFIER UP TO 3000 MC |
| MOUNTING METHOD | PRESS FIT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL LENGTH | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| OVERALL DIAMETER | 0.292 INCHES MINIMUM AND 0.296 INCHES MAXIMUM IN |
| OVERALL LENGTH | 0.620 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 1 FERRULE AND 1 FLANGE |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |