The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_width: 0.107 INCHES MAXIMUM IN, overall_height: 0.300 INCHES MAXIMUM IN, overall_length: 0.300 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-309-7984, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_width | 0.107 INCHES MAXIMUM IN |
| overall_height | 0.300 INCHES MAXIMUM IN |
| overall_length | 0.300 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_circle_diameter | 0.020 INCHES NOMINAL IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 400.0 MILLIWATTS MAXIMUM FORWARD POWER DISSIPATION, DC |
| current_rating_per_characteristic | 0.02 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 30.0 NOMINAL REVERSE BREAKDOWN VOLTAGE, DC |
| NSN | 5961-00-309-7984 |
| OVERALL LENGTH | 0.300 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 0.02 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH | 0.107 INCHES MAXIMUM IN |
| POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS MAXIMUM FORWARD POWER DISSIPATION, DC |
| OVERALL HEIGHT | 0.300 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 NOMINAL REVERSE BREAKDOWN VOLTAGE, DC |
| TERMINAL CIRCLE DIAMETER | 0.020 INCHES NOMINAL IN |