The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN, overall_diameter: 0.055 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-437-6391, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM IN |
| overall_diameter | 0.055 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| end_item_identification | MULTIPLE LAUNCH ROCKET SYSTEM (MLRS) |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| function_for_which_designed | ZENER DIODE |
| specification/standard_data | 81349-MIL-S-19500/127 GOVERNMENT SPECIFICATION |
| voltage_tolerance_in_percent | -5.0 TO 5.0 |
| power_rating_per_characteristic | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| NSN | 5961-00-437-6391 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MOUNTING METHOD | TERMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.3 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| OVERALL DIAMETER | 0.096 INCHES NOMINAL IN |
| POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| SPECIFICATION/STANDARD DATA | 80131-RELEASE5566 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| MATERIAL | GLASS ENCLOSURE |
| MATERIAL | SILICON SEMICONDUCTOR |