The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_length: 2.205 INCHES MINIMUM IN, mounting_method: BRACKET(S), terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.065 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN, special_features: LEADS ARE MATTE TIN,SOLDERABLE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-160-1787, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_length | 2.205 INCHES MINIMUM IN |
| mounting_method | BRACKET(S) |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.065 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN |
| special_features | LEADS ARE MATTE TIN,SOLDERABLE |
| features_provided | HERMETICALLY SEALED CASE |
| precious_material | GOLD |
| internal_configuration | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| terminal_circle_diameter | 0.029 INCHES MINIMUM AND 0.031 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 2 SOLDER STUD |
| NSN | 5961-00-160-1787 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MOUNTING METHOD | TERMINAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 CELSIUS AMBIENT AIR DEGC |
| OVERALL DIAMETER | 0.128 INCHES NOMINAL IN |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL LENGTH | 1.100 INCHES MINIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES MAXIMUM FORWARD CURRENT, DC |
| OVERALL LENGTH | 0.205 INCHES NOMINAL IN |
| MATERIAL | GLASS ENCLOSURE |