1N416BM: SEMICONDUCTOR DEVICE SET.
The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE, overall_length: 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, mounting_method: PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE, overall_diameter: 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN, semiconductor_material: SILICON ALL SEMICONDUCTOR DEVICE DIODE, component_name_and_quantity: 2 SEMICONDUCTOR DEVICE DIODE. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-774-7314, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
| overall_length | 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| mounting_method | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| overall_diameter | 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| semiconductor_material | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| component_function_relationship | MATCHED |
| NSN | 5961-00-774-7314 |
| OVERALL DIAMETER | 0.240 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| OVERALL LENGTH | 0.766 INCHES MINIMUM AND 0.792 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE IN |
| COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| MATERIAL | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |